1) Layers: 1L-28L
2) Material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free,
3) Board finished thickness: 0.2mm-7.0mm
4) Solder mask color: green/yellow/black/white/red/blue
5) Max. finished board size: 23 × 25 ( 580mm×900mm )
6) Min. Line width: 3mil (0.075mm)
   Min.Line spacing: 3mil (0.075mm)
7) Min. drilled hole size: 3mil (0.075mm)
8) Surface finish/treatment : HASL / HASL lead free, HAL, Chemical tin,

Chemical Gold, mmersion Silver/Gold,OSP,Gold plating
9) Copper thickness: 0.5-7.0 OZ
10) Copper thickness in hole: >25.0µm (>1mil)
11) Inner packing: Vacuum packing / Plastic bag
      Outer packing: Standard carton packing
12) Shape tolerance: ±0.13
     Hole tolerance: PTH: ±0.076   NPTH: ±0.05
13) Certificate: UL, ISO 9001, ISO 14001, SGS, RoHS
14) Special requirements: Buried and blind vias+controlled

impedance+BGA
15) Profiling: Punching, Routing, V-CUT, Beveling
16) Provides OEM services to all sorts of printed circuit board assembly as

well as electronic encased products